Advanced materials
Silicon Nitride Plate
- AlN, high thermal conductivity of 180 W/mk, but strength 205-400 MPa
- Si₃N₄, high thermal conductivity of >80 W/mk, strength 500-800 MPa
New Silicon nitride plate materials for high thermal dissipation
| Properties | AlN | Si₃N₄ |
|---|---|---|
| Strength(MPa) | 250-450 | 500-800 |
| Toughness (MPa·m½) | 3 | 5-8 |
| Thermal expansion coefficient(10-6K-1) | 4.5-4.6 | 2.7-3.4 |
| Dielectric constant | 9 | 7.5 |
| Cost | expensive | moderate(SRBSN) |
| Thermal conductivity(W/mK) | 100-270 | 70-170 |
- Heat sink for high power device
- Power module for vehicle
- DC/AC inverter